Calculates the ratio (in percent) between pin width and pad width (pin divided by pad) where pin is smaller than or equal to pad. Reports the value closest to 100%.
Calculates the ratio (in percent) between pin length and pad length (pin divided by pad) where pin is smaller than or equal to pad. Reports the value closest to 100%.
Calculates the ratio of toe and heel distances (in percent) where the longer is divided by the shorter, and pin is smaller than, or equal to, pad. The closer the ratio is to ‘1’, the more centered the pin is on the pad. Reports the maximal value detected.
Calculates distances along pin length from ‘toe’ to edge of pad where pin is smaller than, or equal to, pad. Reports the minimal value detected.
Calculates distances along pin length from ‘heel’ of pin to edge of pad where pin is smaller than, or equal to, pad. Reports the minimal value found.
Calculates the ratio between the left distance and the right distance (in percent), where the longer of the two values is divided by the shorter, and the pin is smaller than, or equal to, the pad. Reports the maximal value detected.
Calculates distances from the ‘left’ side of the pin to the corresponding edge of the pad, where the pin is smaller than, or equal to, the pad. Reports the minimal value detected.
Calculates distances from the ‘right’ side of the pin to the corresponding edge of the pad, where the pin is smaller than, or equal to, the pad. Reports the minimal value detected.
Calculates distances along the pin length from the toe to the edge of the pad, where the pin is smaller than, or equal to, the pad. Reports the maximal value detected.
Calculates distances along the pin length from the heel to the edge of the pad, where the pin is smaller than, or equal to, the pad. Reports the maximal value detected.
Calculates distances from the ‘left’ side of the pin to the corresponding edge of the pad, where the pin is smaller than, or equal to, the pad. Reports the maximal value detected.
Calculates distances from the ‘right’ side of the pin to the corresponding edge of the pad, where the pin is smaller than, or equal to, the pad. Reports the maximal value detected.
Calculates the ratio (in percent) between pin diameter and pad diameter (pin divided by pad) where pin is smaller than or equal to pad. Reports the value closest to 100%.
In some components, such as BGA, the pin diameter is larger than the corresponding pad. “Large Pin Diameter” categories handle such cases.
Calculates the ratio (in percent) between pin area and pad area (pin divided by pad) where pin is smaller than or equal to pad. Reports the value closest to 100%.
The greater the value of pin width to pad pitch indicates a smaller gap between their respective copper pads. This should be avoided because it could cause a short.
Differences between the pitch of two pins and their respective two pads causes a shift in pin placement on pad. The largest value reveals whether the pin is still situated within the pad.
Reports values of annular rings - the shortest distance between a pin’s edge and the edge of the surrounding pad or drill if less than or equal to either pp_ar for SMD pins, or pp_clearance for other pins.
Reports missing clearances for each MT pin, for each plane layer the pin penetrates.
Reports intersections of ET pins with each power & ground layer penetrated if clearance or thermal relief is not found around the pin hole.
Reports missing drill holes at pin locations.
Reports ET pins whose drills are not plated through holes.
Reports MP pins whose drills are plated through holes.
Reports values of hole diameter divided by pin diameter (in percent) where pin diameter is greater. Otherwise, pin diameter divided by hole diameter (in percent).
Purpose: To check whether hole size fits a preferred hole size for a particular pin size and shape.
Purpose: To check whether hole size fits a preferred hole size for a particular pin size and shape.
Purpose: To check whether hole size fits a preferred hole size for a particular pin size and shape.
Purpose: To check whether hole size fits a preferred hole size for a particular pin size and shape.
Purpose: To check whether hole size fits a preferred hole size for a particular pin size and shape.
Purpose: To check whether hole size fits a preferred hole size for a particular pin size and shape.
Purpose: To provide a summary of pins lacking a specified preferred size.
Reports all incidences of more than one drill at a pin location.
Reports value of pin diameter minus hole diameter only where pin diameter is greater than hole diameter.
Reports value of hole diameter minus pin diameter only where hole diameter is greater than pin diameter.
Most TH pins should be longer than the thickness of the board to allow for processing of their protrusion on the other side of the board.
Purpose: To report TH pins which should not extend farther than a certain maximum on the other side of the board.
Purpose: To report those TH pins which should not extend beyond the other side of the board.
Reports all pins which come in contact with the solder mask.
Reports all SMT pins and their corresponding pads or exposed portions of their pads which could be considered as toeprints, if so specified by the user.
Reports pads, considered exposed toeprints, which can be divided into two or more parts.
Purpose: To detect possible mistakes in matching VPL components for CAD components.
In some components, like J-leaded, exact dimensions for the pin may not be available. ‘Pin Center to Pad’ categories check whether there is sufficient room for solder joint on both sides of the bend.
In some components, like J-leaded, exact dimensions for the pin may not be available. ‘Pin Center to Pad’ categories check whether there is sufficient room for solder joint on both sides of the bend.
The dimensions and coordinates of recommended pins are inaccurate and a user might want to ignore such pins in reports to avoid false alarms.
The dimensions of non-circular pins and pads are calculated according to their bounding boxes. When a component is rotated, this method produces inaccurate results.