Solderpaste on non-SMD pads may result in shorts.
Missing solderpaste may result in broken net connectivity
Some production processes, such as OSP, require that testpoints have solderpaste applied to make sure that the test probes have good contact.
Some production processes, such as lead-free processes, require solderpaste applied to THMT pads/drills to enhance good soldering.
Solderpaste which does not contact pads, due to solder mask, may result in broken net connectivity.
Solderpaste not on pads may result in shorts.
If solderpaste pads are too close to solder mask clearances, manufacturing imprecisions, such as a shift in the solderpaste stencil or the solder mask layer, could cause solder bridging between solderpaste and the copper inside the solder mask clearance.
Solderpaste pads too close together can cause a short, or indicate a design problem.
Purpose: To detect cases of soldepaste applied too close to the rout.
Purpose: To detect cases of soldepaste applied too close to a PTH drill.
Purpose: To detect cases of soldepaste applied too close to an NPTH drill.
If side wall area is too large in comparison to roof area, the solderpaste might stick to the stencil when removing it from the PCB.
If side wall area is too large in comparison to roof area, the solderpaste might stick to the stencil when removing it from the PCB.
A clearance within a metal mask could lead to an inadequate amount of solderpaste being applied on the board.