Testpoints are grouped into toeprint testpoints (which have component pins) and via testpoints (which have no components and are used for signal transfer or testing).
Testpoints are grouped into toeprint testpoints (which have components pins) and via testpoints (which have no components and are used for signal transfer or testing).
Purpose: To identify nets which have no testpoint access locations.
Reports nets with more than one testpoint. For each CAD net with more than one testpoint, reports the number of testpoints on the net and the net name.
Reports testpoints in accordance with tp_shape.
Reports testpoints which are not component toeprints or via pads.
Reports nets with one testpoint. For each CAD net with one testpoint, reports one signal layer pad (belonging to the net) and the net name.
Testpoints should be kept sufficiently apart in order to allow simultaneous probing without collision.
Testpoints should be kept sufficiently apart to allow simultaneous probing without collision.
Testpoints clearance is required to avoid solder bridging and the potential shorting across two pads with a test probe.
Testpoints clearance is required to avoid solder bridging and the potential shorting across two pads with a test probe.
Purpose: To assure testpoint probes do not touch and have sufficient clearance from exposed copper. Reports only copper pads which are neither via nor toeprint pads.
Certain types of probes can penetrate the solder mask cover and cause false shorts.
Too many testpoint probes concentrated in a small area on the opposite side of the board from a component can cause pressure that could damage the component and crack solder joints.
Testpoints should be kept distant from large, non-plated through holes which may adversely affect the vacuum pressure of the probing arm.
Testpoints clearance is required to prevent potential shorting across two pads with a test probe.
Purpose: To detect tooling holes close enough to a testpoint to cause it damage.
Purpose: To detect via pads whose drills are too large to be used as testpoint.
Purpose: To detect via annular rings which are not large enough to allow proper contact of the probe and the testpoint pad.
Testpoints should be kept distant from the edge of the board so as not to affect the vacuum pressure of the probing arm.
Reports distances between testpoints and conveyed edges (edges parallel to the SMT process) in the rout layer. The test checks the bounding box of the board (the smallest rectangle to contain it). The conveyed edge, in some cases, may be further than the closest rout edge. Proper definition of rout or profile is critical for the accuracy of the check. Does not report copper features with attribute Copper Feature Ignore.
Reports distances between testpoints and non-conveyed edges (edges perpendicular to the SMT process) in the rout layer.The test checks the bounding box of the board (the smallest rectangle to contain it). The non-conveyed edge, in some cases, may be further than the closest rout edge. Proper definition of rout or profile is critical for the accuracy of the check. Does not report copper features with attribute Copper Feature Ignore.
Testpoints should not be placed under components where they cannot be accessed.
A testpoint probe must have access clearance from component bodies.
A testpoint probe must have access clearance based upon component height.
Testpoints must have sufficiently large solder mask openings to provide sufficient metal contact with a test probe.
The area between testpoint copper and a probe must be unobstructed.
Vias capped on both sides do not vent correctly during solder processes.
Uncapped vias increase the possibility of shorts.
Reports testpoints outside the testpoint ‘Keepin’ areas of the board. These areas are placed on the document layers whose names are defined in the Testpoint Keepin Layer job attribute. The areas have attributes Test Point Keep In and Assigned Area to Component Side (with the appropriate value for the layer being checked).
Reports testpoints inside the testpoint ‘Keepout’ areas of the board.These areas are placed on the document layers defined in the Testpoint Keepout Layer job attribute. The areas have attributes Test Point Keep Out andAssigned Area to Component Side (with the appropriate value for the layer being checked).
Silk screen features must be far enough from a testpoint to allow metal contact with a test probe.
Reports nets with a less than expected number of testpoints, as specified in the net attribute Expected Test Point Count.
Reports nets with the exact number of testpoints, as specified in the net attribute Expected Test Point Count.
Reports nets with more than the number of testpoints specified in the net attribute Expected Test Point Count.
Some production processes, such as OSP, require that testpoints have solderpaste applied to make sure that the test probes have good contact.